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PULSE PLASMA SINTERING OF A NANOCRYSTALLINE Cu POWDER
|Marcin Rosinski , Andrzej Michalski , Dariusz Siemiaszko , Jakub Jaroszewicz , Krzysztof J. Kurzydlowski
Warsaw University of Technology, Faculty of Materials Science and Engineering (InMat), Wołoska 141, Warszawa 02-507, Poland
The nanocrystalline copper powders produced by the reaction of the CuO reduction with hydrogen, were consolidated using the pulse plasma sintering (PPS) method. The sintering process was carried out at temperatures between 450 and 600oC under a load of 60MPa for 5min. The average crystallite size of the sinters thus obtained was about 80nm. The sinters produced at 450oC had a relative density of 87%, and those sintered at 600oC – 92%; their hardness was 215HV0.1 and 195HV0.1, respectively, which means that it is threefold as high as that of solid copper with a nanocrystalline grain size of about 50µm. The resistivity of the sinters was about 0.103µΩm i.e. about tenfold greater than that of coarse-grained solid copper.
Presentation: poster at E-MRS Fall Meeting 2005, Symposium I, by Marcin Rosinski
See On-line Journal of E-MRS Fall Meeting 2005
Submitted: 2005-05-18 10:45 Revised: 2009-06-07 00:44