E-MRS Fall Meeting 2008

 on-line journal

Presenting person

September 15th, Monday

14:00 00:30:00 Invited oral Ryszard Pyrz Atomic-continuum equivalence at nanoscale
14:30 00:15:00 Oral Toby D. Young Molecular statics simulation of nanoindentation on nanocrystalline copper
14:45 00:15:00 Oral Pier Luca Palla Molecular dynamics results showing continuum theory failure in describing the elastic behavior of nanoparticles embedded in Si-based systems
15:00 00:15:00 Oral Viktor I. Belko Effect of hydrostatic pressure on defect diffusion in silicon: molecular dynamics simulations

September 16th, Tuesday

09:00 00:30:00 Invited oral Sebastien Mercier Homogenization of elastic-viscoplastic heterogeneous materials: Application to nanomaterials
09:30 00:15:00 Oral Brian Derby Strain gradients and the strength of nanoporous gold
09:45 00:15:00 Oral Pierre Hirel Study of dislocation nucleation activation from surface step by atomistic calculations
11:00 00:30:00 Invited oral Lazar S. Shvindlerman Motion of Connected Grain Boundaries and Stability of Nanocrystalline Systems
11:30 00:15:00 Oral Gaetan Raymond Characterisation of silicon nitride thin films used as stressor liners on CMOS FETs
11:45 00:15:00 Oral Massimo Celino MgH2-Mg interface: a first-principle molecular dynamics characterization

September 17th, Wednesday

09:00 00:30:00 Invited oral Boris I. Yakobson Nanotubes in global warming: From dynamic topology in superplasticity to hyperthermia in cancer treatment
09:30 00:15:00 Oral Grzegorz Litak On buckling of carbon nanotubes
09:45 00:15:00 Oral Jung Mo Seo Characterization of Mechanical Properties of Nanowires by MEMS Actuator
10:00 00:15:00 Oral Rui Dou The strength of gold nanowires
10:15 00:15:00 Oral Huijun Wu A novel three-tier reflective nanofibre structure for high performance thermal resistant but water vapor permeable insulations
11:30 00:15:00 Oral Malgorzata Lewandowska Tailoring mechanical properties by grain refinement and particle redistribution
11:45 00:15:00 Oral Tae ok Kim Mechanical Properties of Lead Free Solder Material at High Temperature
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