ELFNET: A European Network on Lead Free soldering
Interaction of Ag-In-Sn Solders with Palladium Substrates: A Phase Diagram Approach
Comparison of wetting and mechanical properties of Cu/Sn-based solder couples produced under vacuum and under flux
Description of the mechanical performance of Cu-SnAgCu-Cu joints
Optimization of particle reinforced lead-free solders
Development of nanoparticle reinforced brazing filler metals and solders: the aspects of downscaling from micro to nanoscale
Ti layer ion assisted deposition in metal ceramic bonding
Model for intermetallic phase and intermetallic compound solidification during diffusion soldering
Relationship between condition of deposition and properties of W-Ti-N thin films prepared by reactive magnetron sputtering
Tensile deformation behaviour of the titanium alloy with hard elastic coating
Characteristics of welded joints and cracks occurred during pad welding of superalloy Inconel 713C
Structure and properties of joints of 14-5 PH steel and PM Fe-TiC composite using filler metal BNi2/MBF 20
The Wetting Behaviour and Interface Structure of Unreinforced and Particle Reinforced Lead-Free Solders
