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Effect of solution flow velocity on the step bunching in solution growth of SiC |
Can Zhu 1, Shunta Harada 1, Kazuaki Seki 2, Miho Tagawa 1, Yuji Matsumoto 3, Tomohisa Kato 4,5, Kazuhisa Kurashige 5,6, Hajime Okumura 4,5, Toru Ujihara 1 |
1. Department of Materials Science and Engineering, Nagoya University, Furo-cho, Chikusaku, Nagoya 464-8603, Japan |
Abstract |
Silicon carbide (SiC) is a wide band gap semiconductor material for future electronics in high-power, high-temperature, and high-frequency applications. Solution growth is a promising method to achieve high quality crystals because the growth proceeds under the condition close to the thermal equilibrium. Recently we revealed that threading dislocations are converted to basal plane defects by the step-flow during the solution growth. By utilizing the threading dislocation conversion, we achieved drastic reduction of dislocation density. However, during the solution growth, step bunching always occurs. By the step bunching, the excess development of macrosteps can lead to the macroscopic defects such as rough growth surface and solvent inclusion. In this study, for the reduction of the step bunching during the solution growth of SiC, we investigated the effect of solution flow velocity on the step bunching behavior. SiC crystal growth was conducted by the specially designed top seeded solution growth (TSSG) configuration. In our growth experiment, the seed crystals were placed at the position deviated from the center of the crucible. By only rotating the crucible, controlled solution flow was obtained on the growth surface. In this study, the off-angled 4H-SiC was used as seed crystals. We carried out the growth under two different solution flows, in which the solution flow direction and step-flow direction was the same (here we call parallel flow) and opposite (anti-parallel flow). As shown in Figure 1, wide and flat macro-terraces were frequently observed under the parallel flow, while the step trains with narrow macro-terraces were observed under the anti-parallel flow. Figure 2 shows that the surface roughness of the grown crystal under the parallel flow was larger than that of anti-parallel flow. Under the parallel flow, the surface roughness increases with increasing solution flow velocity. On the other hand, the surface roughness was independent of the solution flow velocity under the anti-parallel flow. This can be explained by the change of solute concentration distribution above the crystal surface which controls the behavior of step bunching. Under the parallel flow, the high-concentration solution moves to the edge of macro-terrace, which results in the microsteps run into the macrosteps quickly and then the surface roughness increases. While under the anti-parallel flow, the high-concentration solution moves to the macrosteps from the front direction, thus the microsteps run out of the macrosteps, which keeps the surface roughness stable. We figured out that the solution flow control could be an effective way to control step bunching during the solution growth of SiC. Acknowledgement: This study was partly supported by Novel Semiconductor Power Electronics Project Realizing Low Carbon-Emission Society of Ministry of Economy, Trade and Industry through R&D Partner-ship for Future Power Electronics Technology (FUPET). |
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Presentation: Poster at 17th International Conference on Crystal Growth and Epitaxy - ICCGE-17, General Session 2, by Can ZhuSee On-line Journal of 17th International Conference on Crystal Growth and Epitaxy - ICCGE-17 Submitted: 2013-03-25 06:55 Revised: 2013-04-15 12:01 |