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Silver nano-inks for printable electronics

Andrzej J. Mościcki 

Amepox Microelectronics, Ltd. (AMEPOX-MC), Jaracza 6, Łódź 90-268, Poland

Abstract

     The techniques of the assembly in present miniaturized electronics are based on structures and contacts with micrometer sizes scale. Executing such structures requires the special, precise techniques of printing, assembly and special materials to the realization of these tasks.

 

     Among many new or modified methods for making electronic devices  (e.g. Screen, R2R, and others similar), one from recent, there is the method of the technique pulse printers (Ink-jet printing). To the realization of this type of the technology, except the using of suitable devices, necessary is applying special materials called the inks. Such a ink has to fulfill several basic conditions, and namely:

     - be characterize approximate features to so-called proper solutions (or “true fluid”),

     - should has very low viscosity value,

     - realize special physical functions e.g. the electrical conductive properties.

 

     The simultaneous realization of all introduced conditions requires the use special prepared components e.g. the fillers with possibly small, especially the nanometer sizes. The electrically conductive inks for printing microstructures contain the fillers with nano size noble metals (mostly the silver) with the highest and stable electric conductivity. However the use of nano size silver possible will be with the base condition, that the nano particles will do not undergo the agglomeration i.e. to creating larger structures.

 

     Basic questions connected with the method of printing the electrically conductive structures by Ink-jet techniques will be presented with some information about inks properties especially with point of view of low temperature sintering possibilities.

 

 

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Related papers

Presentation: Invited oral at Warsaw and Karlsruhe Nanotechnology Day, by Andrzej J. Mościcki
See On-line Journal of Warsaw and Karlsruhe Nanotechnology Day

Submitted: 2011-09-15 12:52
Revised:   2011-09-16 17:24