Search for content and authors
 

Three-dimensional phase field modeling of silicon thin-film growth during directional solidification: facet formation and grain competition

Chung-Wen Lan ,  Hua-Kai Lin 

National Taiwan University, 21 Hsu Chow Road, Taipei city 10020, Taiwan

Abstract

Adaptive phase field modeling is applied to simulate directional solidification for silicon in three dimensions. Several functions are considered for the highly anisotropic interfacial energy and kinetic coefficient of silicon. The morphological evolution and the thermal field near the interface are presented and compared with experiments. The mechanisms for facet formation and grain competition are further discussed.

 

Legal notice
  • Legal notice:
 

Related papers

Presentation: Oral at 17th International Conference on Crystal Growth and Epitaxy - ICCGE-17, Topical Session 5, by Hua-Kai Lin
See On-line Journal of 17th International Conference on Crystal Growth and Epitaxy - ICCGE-17

Submitted: 2013-06-02 13:57
Revised:   2013-06-02 13:57