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Electrical Conduction and Dielectric Relaxation of a-SiOx (0<x<2) Thin Films Deposited by Reactive r.f. Magnetron Sputtering |
Nicolae Tomozeiu |
R-D Department, Oce Technologies B.V., Urbanusweg 43, Venlo 5900MA, Netherlands |
Abstract |
Silicon oxide (a-SiO) is one of the most used silicon-based materials in optoelectronic and microelectronic technologies. Previously, we have reported that the a-SiOx (0<x<2) physical properties related to the material structure show a kink point in their evolution when x varies. It was found that highly oxygenated a-SiOx thin films are inhomogeneous (silicon-rich nanoclusters embedded in oxygen-rich material). In this paper, we focus on electrical conductivity and carriers' transport mechanisms in a-SiOx. Dc current-voltage characteristics are analysed by using the Pollak and Riess model of the percolation theory. A special attention is paid to the trapped charge in so called “dead ends” of the carriers’ path. The current-time (for constant voltage pulses measurements) characteristics’ analysis reveals the chargeability behaviour of the material. The ac measurements have also been employed to investigate the electrical character of the SiOx thin films. Both the modulus and the argument of the complex impedance have been analysed on SiOx (with x>1), when the frequency was varied between 102 and 106 Hz. The variation of the impedance modulus with the frequency showed a capacitive behaviour: in logôZô=f(log w) plots, the slope of the linear variation was found around –1. Similar results have been obtained studying the argument variation [arg ZÎ(-75;-900)]. The intensive parameters as dielectric constant and electrical conductivity have been calculated. The results of this study revealed that a-SiOx sputtered thin films are characterised by dielectric relaxation and electrical conductivity (with a transport mechanism described by variable range hopping).
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Presentation: Oral at E-MRS Fall Meeting 2007, Symposium H, by Nicolae TomozeiuSee On-line Journal of E-MRS Fall Meeting 2007 Submitted: 2007-05-21 22:40 Revised: 2009-06-07 00:44 |