Nano-inks for printing of electric circuits for microelectronic technology

Andrzej J. Mościcki 1Anita K. Smolarek 1Tomasz Fałat 2Andrzej E. Kinart 1

1. Amepox Microelectronics, Ltd. (AMEPOX-MC), Jaracza 6, Łódź 90-268, Poland
2. Wrocław University of Technology, Faculty of Microsystem Electronics and Photonics (WEMIF), Janiszewskiego 11/17, Wrocław 50-372, Poland


   Actual microelectronic industry needs new and advanced materials and technologies for reason of miniaturization and very high reliability. Nano sized metals as silver or copper as a electrically conductive fillers gave possibility to develop new types of formulations called Nano Inks for packaging technologies and for making electrical circuits on rigid substrates and flexible polymer foils. The paper present information about possibility use of nano size silver for electronic packaging technologies.

   Each kind of ink, needs different nano silvers is shown in Fig. 1 and Fig. 2.

Figure 1. SEM picture of the smallest nanoAg and particle size distribution by “Malvern Zeta Sizer”.

Figure 2. SEM picture nanoAg and particle size distribution by “Malvern Zeta Sizer”.

   As it is well known, nanosized silver does not exist without protection layer around each particles. When metallic nanoparticle inks are heated the dispersants first, and protective layer the second, should be effectively removed allowing the remaining active metallic nanoparticles to be successfully sintered. We have tested several types of nanosilvers with different coating shells. Basing on Ag with paraffin and polymer coating the conductive inks were tested in Amepox lab.

   The base properties of the inks are shown in Table 1.


Ink with 3-8 nm silver filler

Ink with 60 nm silver filler


7,5 – 10,5 mPas

5 – 12 mPas

Sizes of silver particles

3 -8 nm

50 - 60 nm

Percentage of silver filler

40 - 60%

20 - 30%

Surface tension value

28,5 – 32,5 mN/m

~ 35 mN/m

Specific gravity

1,1 – 1,3 g/cm3

0,8 – 1,0 g/cm3

Sintering temperature


up to 150oC

Electricaly resistivity

(4 – 6) x 10-6 Ωcm

5 x 10-6 Ωcm

Printing possibility

High temperature flexible substrates

Low temperature flexible substrates

   In this paper, we report on the basic properties of different inks, conditions for making printed stuctures and other possibilities as microvias interconnections (Fig.3). 

Figure 3.   A – Interconnection through microvia-hole by using ink. B – Printed structures on polymer foil.

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Presentation: Invited oral at Nano and Advanced Materials Workshop and Fair, by Andrzej J. Mościcki
See On-line Journal of Nano and Advanced Materials Workshop and Fair

Submitted: 2013-06-25 13:43
Revised:   2013-06-25 13:43
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