Filler Metals, Solders and Joints of the next generation
Today's complex requirements for structural components often cannot be entirely fulfilled by a single material. Hence, different materials (metal and ceramics, advanced composites with conventional materials) have to be combined to form joints. When joining dissimilar materials, such as metals and ceramics, problems resulting from the differences in physical and thermal properties of the material groups have to be overcome.
Joining materials is also a most important process when producing electronic components. However, even in the case when the materials are mostly the same, or at least similar physical properties, the miniaturization trend and the environmental issues (lead prohibition in electronics) are confronting the scientific and engineering communities with new challenges.
Novel filler metals and new solders have to be developed and reliable joints have to be produced to meet the specific requirements. Therefore, the correlations between the joint design, the microstructure and the properties have to be understood. Residual stresses play a crucial role, especially in case of joints of dissimilar materials. The internal and external interfaces in the combined materials strongly affect the joint reliability and need to be characterized and controlled. Furthermore there are still several open questions concerning joint design, processes and characterization. The symposium should bring together the scientific community from different fields (e.g. physics, chemistry, material science and engineering) as well as industry to review and discuss the relevant issues which are prerequisites for stimulate progress in this area.
The session is supported by the COST531 action "Lead-free solders".
Dr. Manfred Boretius, Listemann AG, Liechtenstein
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