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The effect of magnetic field in Cu and Al thin film production of DC magnetron sputtering

Mahmood Sabooni 1,  Ashraf Mirkamali 2,  Mahmood Ghorrannevis 3,  Amirhossein Sari 3,  Ali Hojabri 2,  Hamed Hosseini 3

1. Islamic Azad University, Shahrood Branch, Shahrood 3615643159, Iran
2. Islamic azad University, Karaj Branch, Gohardasht St.Moazzen AcrossIslamic azad University, Karaj Branch, Karaj 31485313, Iran
3. Plasma Physics Research Center, Science and Research Campus of Islamic Azad University, Tehran, Tehran 3659482637, Iran

Abstract

Magnetrons Sputtering are used for thin film deposition and sputter etching [1]. In these devices an electric sheath and external magnetic field are configured to trap electrons [2, 3]. In front of the cathode surface the magnetic field creates a zone "magnetic trap" where the electron loss rate is reduced and the ionization probability enhanced [4]. The ensuing ions, having Larmor radii much larger than the magnetic trap size, are accelerated by the electric field towards the cathode where they sputter particles which deposit as a film over a suitable substrate [5]. In this paper the effect of magnetic field on production of Cupper and Aluminum thin film have been studied. Cu and Al films were deposited on glass substrates without heating by DC magnetron sputtering in pure Argon gas. The coil current increased from 2A to 9A. X-Ray diffraction, Spectrophotometer, SEM and Atomic Force Microscopy were used to observe the structural characterization of the films. The results show that there is an optimum magnetic field for the maximum sputtering rate. Surface properties could be affected by this experiment dramatically. Details and a model which plasma sheath plays an important role will be discussed in full paper.

References:

[1] J. A. Thornton and A. S. Penford, Thin Film Processes, J. L.Vossen and W.
Kern, Eds. New York: Academic, 1978, pp.75.
[2] B. Chompan, Glow Discharge Processes. New York: Wiley, Interscience, 1980,
pp.177-184, 265.
[3] T. E. Sheriden, M. J. Goeckner and J. Goree, J. Vac. Sci. Tech., vol. A8,
pp. 30-37, 1990.
[4] A. S. Penfold, Handbook of Film Process Technology. IOP (1995), Sec. A.
3.2, p. 1.
[5] G. Serianni, V. Antoni, R. Cavazzana, G. Maggioni, E. Martines, N. Pomaro,
V. Rigato, M . Spolaore and L. Tramontion, 27^{th} EPS Conference on Contr.
Budapest. ECA Vol. 24 B 17020, 2000.
 

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Presentation: Poster at E-MRS Fall Meeting 2007, Symposium J, by Mahmood Sabooni
See On-line Journal of E-MRS Fall Meeting 2007

Submitted: 2007-02-19 06:33
Revised:   2009-06-07 00:44