The toxicity of lead containing solders caused the strong need of development of other types solders. Although nowadays the most prominent lead-free solders are based on alloys of tin with small amounts of silver and copper, other types, based on Sn-In, Sn-Bi and Sn-Zn systems, are under development As microstructures formed during the solding are related to the phase equilibria of the solding materials and other metals, used as the substrates in electronic devices, the knowledge of thermodynamic properties of alloys is essential for the correct description of the technologic processes.Copper is one of the most popular materials for electronic devices, hence in this work, there are studied thermodynamic properties of Cu-Sn-Bi system. Isopiestic method is applied for the bismuth activity measurements and on the basis of the experimental results interaction parameters are calculated.

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