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Application of Ultrasound in the Wafer Fabrication: 1) Development of an Ozone Detector and 2) Degasification of Process Water |
Jörg Hofmann , Ute Freier , Mike Wecks |
Institut für Nichtklassische Chemie (INC), Permoserstraße 15, Leipzig 04318, Germany |
Abstract |
Ozone is widely used in the etching technology of wafers and other microelectronic components and in water treatment, too. For both applications a ruggedly designed ozone detector owning high metering precision is necessary. In the ozone detector ultrasound is used to degrade the dissolved ozone to enable the calibration of the zero point of the measuring equipment. The degassing and deozonization are key steps during the water circulating process in the fabrication of wafers and microelectronic components. Ultrasound enables a high effective degassing of process and waste water.
Ozone detector
Degasification of process and waste water The degassing process is applied in treatment of process water of wafer fabrication, in the air sparkling of contaminated ground water, in the biogas plants etc. In the ozone elimination process of the wafer fabrication the ultrasound has to be applied at high flow rates of water and short contact times. To increase the efficiency the ultrasound parameters (power, frequency etc.), process parameters and the reactor geometry were optimised. |
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Presentation: Poster at COST action D32 Mid term evaluation meeting, by Jörg Hofmann Submitted: 2006-03-24 13:34 Revised: 2009-06-07 00:44 |