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Preparation and characterization of nanocrystalline copper layers

Marcin Sęk ,  Maria Trzaska 

Warsaw University of Technology, Faculty of Materials Science and Engineering (InMat), Wołoska 141, Warszawa 02-507, Poland

Abstract

Investigations performed by the authors of this paper are focused on copper surface layers deposited by electrocrystallization method and exhibiting nanocrystalline structures. The intention of this research is an identification of optimum parameters for the manufactur-ing process leading to such type of surface coatings as well as determination of correlations between the structure and properties of the nanocrystalline copper layers and the composition of an electrolyte on one hand and the process parameters of their deposition on the second hand.
In this paper results of structures and hardness investigations of produced layers are presented. The structural analysis of produced layers was executed with the help of the dif-fractometer of X-ray type PHILIPS PW-1830. The size of crystallites of the material of de-posited layers were appointed as results of analysis of X-ray lines profile with use of the Scherrer’s formulae. The results of investigations of the topography and morphology of the copper surface layers by the method of electron scanning microscopy (SEM) are presented. The structure of deposited layers as well as sizes and shapes of their grains were determined by the use of transmission electron microscopy (TEM).
The performed investigations permitted to establish the chemical composition of the electrolyte as well as parameters of the process enabling the deposition of the nanocrystalline copper layers by the electrocrystallization method. The material of produced nanocrystalline copper surface layers is characterized by the compact polycrystalline structure with dimen-sions of the grains near 20 nm. This nanocrystalline structure layers show higher hardness than classic Cu surface layers exhibiting micrometric grain dimensions which were produced also by the electrocrystallization method.

 

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Related papers

Presentation: poster at E-MRS Fall Meeting 2004, Symposium I, by Marcin Sęk
See On-line Journal of E-MRS Fall Meeting 2004

Submitted: 2004-05-31 12:10
Revised:   2009-06-08 12:55