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Thermal conductivity measurement of a La5Ca9Cu24O41 thin film using the 3ω method.

Georgios I. Athanasopoulos ,  Efthymios C. Svoukis ,  Maria Pervolaraki ,  Ioannis Giapintzakis 

University of Cyprus (UCY), Kallipoleos Avenue, Nicosia 1678, Cyprus

Abstract

Through the last decades great effort has been put in the microelectronics industry on the fabrication of new devices always trying to reduce size while at the same time increasing performance and reliability. However, the increase of temperature on these devices is the main problem arising. Thus, thermal management and controlling of temperature on the devices are important issues. To address this problem, accurate thermal characterization of the materials been used is very important.

Materials like La5Ca9Cu24O41 have magnetic thermal conductivity (of the order of 100 W/mK at room temperature) as efficient as metallic heat conductors with the benefit of being electrically insulating. Furthermore La5Ca9Cu24O41 is highly anisotropic.

A possible strategy for heat dissipation is the use of a La5Ca9Cu24O41 thin film to guide the heat to a heat sink.

Traditional steady state methods used for thermal conductivity measurements cannot be employed on thin films due to their very small mass. A dynamic method (3ω) is therefore used.

We will present thermal conductivity measurements of a La5Ca9Cu24O41 thin film using the 3ω method.

 

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Related papers

Presentation: Oral at E-MRS Fall Meeting 2008, Symposium I, by Efthymios C. Svoukis
See On-line Journal of E-MRS Fall Meeting 2008

Submitted: 2008-05-15 14:00
Revised:   2009-06-07 00:48