It is well known that in disordered solid solutions, the resistivity of metals and alloys is strongly influenced by the atomic displacements, vacancies and intersticials. In this work, were produced samples of alloys on the base of Cu-Ni from high purity precursors, to study the interactions between the metallurgical and thermodynamic processes that determine the strength-electrical conductivity combinations of Cu_x%- Ni_y% alloys, doped with Sn, Be, Pt, Cr and Nb. A sequence of thermo mechanical treatments was developed with the intention of increasing the hardness maintaining the electrical conductivity of the alloys. Then they were characterized by optical microscopy and Vickers micro hardness measurements. Their electrical conductivity was measured with a milliohmeter Agilent (HP) 4338B. Substitutional solid solutions with the dopant Sn showed a clear increasing of hardness and decreasing of conductivity, as predicted by the literature. X-ray diffraction data of the samples were collected with a Rigaku MultiFlex difractometer with a fixed monocromator. The experimental conditions were: 40kV, 20mA, 10^o < 2θ < 120^o, Δ2θ = 0.02^o, λCuKα, divergence slit = 0.5^o, reception slit = 0.3 mm and step time 5 s. Refinements of the crystalline structure of the samples were performed by the Rietveld method, using the refinement program GSAS. The refinement results and Fourier differences calculations indicate that the metal atoms occupy substitutional sites in the alloy structure. The refinements also allowed a study of the dependence of the micro-structure and the thermomechanical treatments of the samples and its relation with the strength and electrical conductivity.

References:
1. Monteiro, W. A., Cosandey, F., Bandaru, P., The effect of termo mechanical treatment on the microstructure of a Ni-Cu-Be alloy, THERMEC`97, Australia, 1997.
2. A.C. Larson, R.B. Von Dreele, Los Alamos National Laboratory. Los Alamos, EUA. Copyright, 1985–2000, The Regents of the University of California, 2001.

Acknowledgments: Mackpesquisa, CAPES

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