The ELFNET programme, which was completed in March 2007 produced a roadmap which indicates that there is still a significant amount of research required before High temperature and Power handling Electronic systems can become compliant with the EU RoHs directive.

The implementation of Lead(Pb) Free Electronic Interconnection was expected to create a significant problem for European Industry in July 2006 when the RoHS directive came into force. However, the exemptions for Lead Free do appear to cover 75% or European Industry particularly in the applications for Harsh Environment electronic systems.  These exemptions are expected to be removed in forthcoming legislations and so the implications for electronics interconnection in this area of industry are that the problems have yet to be resolved.

The work of ELFNET is reviewed and looks at all aspects of interconnection, detailing where lead free technology has problems and where future development will be needed.  High Temperature aspects are key features in each of the 7 sections of the Roadmap that looks at the needs of interconnection out to the year 2020.  Issues covering the needs for supply, marking, modelling and simulation are reviewed.  The needs for better understanding of existing materials, new materials and related process technologies have been addressed and there is evidence that reliability is the single most important issue. For this new testing, life cycle analysis and sustainability models need developing, affecting the whole process from chip to system.

ELFNET is being re-invented in the newly formed ‘Interconnect Virtual Institute’ which will be introduced to show why continuation of project work is necessary to bring Pb-free to harsh environment applications and continue work that is going on in Europe towards the implementation of a strategy for high temperature applications areas.

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