Electronics are used in modern oil and gas exploration to collect, log, and/or process data such as heading and inclination, weight on the bit, vibration, seismic/acoustic response, temperature, pressure, radiation, and resistivity of the strata. High-temperature electronics are needed that can reliably operate in deep-well conditions (up to 250°C). The U.S. Department of Energy DeepTrek program has funded two projects led by Honeywell. The first project, launched in 2003 and completing this year, established a production-level integrated circuit (IC) manufacturing process, components and design tools [1-4] specifically targeting high-temperature environments (up to 250°C). The second project, launched in 2006 and completing in 2008, will develop rugged packaging suitable for down-hole shock and vibration environments which will be used to house and demonstrate components developed in the earlier project.

This paper will describe updated results of these projects. This will include previously unreported results obtained from prototype testing of high-resolution A-to-D converter and a high temperature single-poly floating-gate EEPROM, and a 12-bit Successive-approximation A-to-D converter. Also, a Multi-Chip Module (MCM) being developed as a complete down-hole processing unit will be discussed

REFERENCES

1. B. Ohme, “Development Of SOI CMOS Electronics Under The DeepTrek Program”, International Conference on High Temperature Electronics (HITEN), July 2003.

2. B. Ohme, T. Lucking, T, G.R. Gardner, E.Vogt, J.C. Tsang., “High Temperature 0.8 Micron 5V SOI CMOS for Analog/Mixed Signal Applications”, IMAPS Int’l. Conference on High Temperature Electronics (HiTEC), May 2004

3. E. Mallison, J. Rogers, B. Ohme, “High Temperature SOI CMOS Electronics Development: The Deep Trek Project” International Conference on High Temperature Electronics (HITEN), Sept 2005.

4. B. Ohme, M.R. Larson, S. R. Erickson, J. Riekels, S. Schlesinger, K. Vignarajah, M.N. Ericson, “Progress Update on Honeywell’s DeepTrek High Temperature Electronics Project”, IMAPS Int’l. Conference on High Temperature Electronics (HiTEC), May 2006

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