Microstructure of copper films is investigated by electron back scatter diffraction technique (EBSD). The automatic analysis of these EBSD pattern yields for every scan point the crystallographic orientation and phase and a value indicating the quality of the diffraction pattern. From this data the microstructure of the scanned area can be reconstructed. The resulting crystal orientation maps give a vast amount of information on the sample, including kind and distribution of different phase, size, form and defect condition of grains, kind and position of grain boundaries, local crystal orientation and misorientation distribution (texture) and other more. Aim is to prove that EBSD is a useful characterisation tool to identify copper films. Because of its films low resistivity, high resistance to electromigration and high thermal conductivity, copper is replacing aluminum as metal for multilevel interconnections. These copper precursors are believed is good stuff for interconnection metallization. Energy dispersive X-ray analysis has been used to confirm and complement the results obtained by EBSD. The phase copper and copper oxide could be identified by discriminate crystallographically dissimilar phases.

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