| Search for content and authors |
|
|
| |
 |
- Burkhard Schelle
|
| e-mail: | ***@uni-due.de |
| phone: | +49-203-3791090 |
| fax: | +49-203-3792888 |
| web: | |
| interest(s): | |
|
Affiliation: |
University of Duisburg-Essen
|
| address: | Lotharstr. 1, Duisburg, 47057, Germany | | phone: | +49-203-3794446 | | fax: | +49-203-3794453 | | web: | http://www.nppt.de | |
Participant: |
|
Publications: |
- Material characterization for packaging of high temperature integrated circuits
- Reliability testing of wire-bond at High Temperature Storage
|
