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Modeling of Silicon Carbide Semi-Insulating Properties |
Oliwia M. Gąbka 1, Paweł Kamiński 2, Antoni Siennicki 1 |
1. Warsaw University of Technology, Institute of Microelectronics & Optoelectronics (imio), Koszykowa 75, Warszawa 00-662, Poland |
Abstract |
Silicon carbide is a wide bandgap semiconductor with the unique electrical and physical properties, including high breakdown voltage and excellent thermal conductivity. However, for the fabrication of a new generation of electronic devices operating at high power densities, high frequencies, and high temperatures, semi-insulating silicon carbide (SI SiC) wafers with a resistivity higher than 105 Ωcm are necessary. These devices can be produced either by homoepitaxy (SiC MESFETs) or heteroepitaxy (GaN/GaAlN/GaInN structures) on SI SiC substrates. The semi-insulating SiC crystals are obtained by compensating the residual shallow donors and acceptors with deep-level centers introduced either by vanadium doping or by controlled generation of native point defects. In such crystals, the Fermi level is pinned near the midgap to a partially ionized deep level. The former method is widely used for SiC bulk crystals grown by conventional physical vapor transport (PVT) technique. The latter one is more effective for the crystals of higher purity grown by high temperature chemical vapor deposition (HTCVD). |
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