The study presents capabilities of diffusion – soldering technology as an simple way to achieve mechanically stable interconnections which can be useful especially in electronic equipment. The joint is formed due to isothermal solidification and subsequent diffusion in solid state and it consisits of one or more intermetallic phases with melting temperatures much higher than the temperature used for the fabrication of the joint. The diffusion soldering is also a potential candidate for replacement of harmful Pb-Sn solders. In the present study the process was applied to join the copper substrates by the thin foil of low melting materials – either In-Bi (72 C) or In-Sn (119 C) eutectic alloys.

INSTRON tensile testing machine was used for shear strength tests of the joints fabricated in the broad range of the temperatures (100 – 300 C). Scanning Electron Microscopy investigation was used to identify the intermetallics present in the interconnection area and also to describe the fracture surface after the mechanical test.

• Legal notice:
  

  Copyright (c) Pielaszek Research, all rights reserved.
  The above materials, including auxiliary resources, are subject to Publisher's copyright and the Author(s) intellectual rights. Without limiting Author(s) rights under respective Copyright Transfer Agreement, no part of the above documents may be reproduced without the express written permission of Pielaszek Research, the Publisher. Express permission from the Author(s) is required to use the above materials for academic purposes, such as lectures or scientific presentations.
  In every case, proper references including Author(s) name(s) and URL of this webpage: https://science24.com/paper/3758 must be provided.