Reactive sintering of diamond-SiC nanocomposites is possible by thorough mixing of diamond and silicon nanosize powders or by ball milling mixtures of diamond and silicon powders. Properties of nanocomposites were characterized by scanning electron microscopy, XPS, Raman scattering and x-ray diffraction. Diamond-SiC nanocomposites had remarkably high fracture toughness and were significantly harder than the sintered pure nanocrystalline diamond compacts. Broadening of x-ray lines was explained in terms of plastic deformations and average sizes of diamond and silicon carbide crystals. Results were compared with those obtained for pure diamond and silicon carbide nanocrystals after high pressure, high temperature treatment. Graphitization of diamond was also discussed.

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