Most of components in medical applications, measurement and control and other highly reliable devices are mounted on printed circuit boards (PCB) with the use of standard techniques such as reflow soldering and wave, the leaded solder is used. Those products are within the exemption of directive RoHS [1]. It is so because of the reliability of lead-free solder joints was in doubt. Bulky components or temperature sensitive are mounted during additional steps such as automatic selective soldering with the use of dedicated fluxes for this technique. Hand soldering is often abandoned because of reliability is questionable and is dependent of operator [2]. This topic became more complex after 1-st of July 2011 when an amendment to RoHS directive was published known as RoHS2 [3]. In this directive medical equipment and measurement and control devices are not any more in the exemption, that’s why have to be produced in lead-free technology.

The quality of solder joint [4] in lead-free selective soldering is very dependent on application of flux and its composition. As the time during soldering is short the enough heat has to be transferred to activate the surface, by chemical reaction of flux as well as make solder joint as such.

Practical aspects of the usage of the developed fluxes will be presented. The fluxes are designed to work with lead-free solders. Crucial aspects of obtaining reliable solder joint for demanding applications will be presented.

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1. Novel Efficient Routes to Encapsulated Zinc Oxide Quantum Dots and Nanoparticles From Well-Defined Organometallic Precursors
2. Nanosized ZnO clusters from Organometallic One-Component Precursors