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Copper plating on carbon nanotube for manufacturing aluminum matrix composites

Jun Hyun Han 1Hyun Kwang Seok 2Sang Soo Lee 2Kwang K. Jee 2

1. Korea Institute of Science and Technology, Advanced Metals Research Center (KIST), Seoul 130-650, Korea, South
2. Korea Institute of Science and Technology, Material Science and Engineering Division, Seoul, Korea, South


Carbon nanotube (CNT) has been attracting much interest as a reinforce material in metal matrix composites due to its outstanding properties such as high strength and high elastic modulus. However, its entanglement due to van deer vaals interaction holds back its uniform distribution in aluminum matrix. In addition, its poor wetting property on aluminum and difference in density between CNT and aluminum have been great obstacles for manufacturing composites. In this study, in order to enhance the uniformity of distribution of CNT in aluminum matrix and increase the density of CNT, the CNT was coated with copper film by means of electroless plating. The effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on CNT were studied. Ultrasonic irradiation was applied both during dispersion of CNT and electroless plating containing preplate process. The dispersion of CNT and flatness of the plated copper film are discussed based on the changes in surfactant concentration and preplate process time. It was clearly appeared that low concentration of surfactant and short time of preplate process could promote the disentanglement of CNT and even copper plating on CNT.


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Related papers

Presentation: Poster at E-MRS Fall Meeting 2009, Symposium I, by Jun Hyun Han
See On-line Journal of E-MRS Fall Meeting 2009

Submitted: 2009-05-11 09:25
Revised:   2009-06-07 00:48