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Measurements of strain in ceramic components using magnetostrictive delay line

Roman Szewczyk 1Jacek Salach 1Adam Bieńkowski 1Marek Kostecki 2A. Olszyna 2Aleksandra Kolano-Burian 3

1. Warsaw University of Technology, Faculty of Mechatronics, Św. Andrzeja Boboli 8, Warszawa 05-525, Poland
2. Warsaw University of Technology, Faculty of Materials Science and Engineering (InMat), Wołoska 141, Warszawa 02-507, Poland
3. Institute of Nonferrous Metals, Sowińskiego 5, Gliwice 44-100, Poland


The real time measurements of strain of ceramic components is required in many machine industry applications. This paper presents novel application of magnetostrictive delay lines, which gives possibility of real time monitoring of strain in ceramic components.

Magnetostrictive delay line was made of Fe-Si-B amorphous alloy in as-quenched state. Such alloy exhibit high saturation magnetostriction (which exceeds 30 μm/m) together with high stress strength. As a result such amorphous alloy exactly meets requirements of material for magnetostrictive delay line.

Amorphous alloy based magnetostrictive delay line was mounted outside of ceramic bar to improve wave propagation conditions. Manuscript presents the results of measurements of influence of external force applied to ceramic bar on the shape of signal generated by wave in magnetoelastic delay line.

Moreover specialized electronic converter utilizing sample-and-hold integrated circuit was developed. Paper presents transfer characteristics of developed sensor based on magnetostrictive delay line. These characteristics connect value of force applied to ceramic bar with output voltage. It was verified, that changes of output signal exceed 3 volts, which confirm possibility of technical application of developed sensor.

This work was supported by Polish Ministry of Science and Higher Education under Grant PBZ-KBN-095/T08/2003.


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Related papers

Presentation: Poster at E-MRS Fall Meeting 2008, Symposium C, by Roman Szewczyk
See On-line Journal of E-MRS Fall Meeting 2008

Submitted: 2008-05-11 20:12
Revised:   2009-06-07 00:48