The wetting behaviour of the SnCuAg solder on Cu and Ni substrates has been studied by a sessile drop method using the solder in the form of bulk material, solder paste or composite solder paste reinforced with 10% metallic particles (either Cu or Ni). Structural characterization of the interfaces and evaluation of their mechanical properties have been done on solidified sessile drop couples. The effects of particulate reinforcement, procedure used for the preparation of composite paste solder and testing conditions on the structure of the solder before and after wettability test as well as on interface structure of the solder joints were analized in order to explan different wetting behaviours and mechanical properties of corresponding joints.

This work was done under the group project GP7 entitled "Prediction of New Generation Solders" and realized in the framework of European Concerted Action on "Lead-free solder materials" (COST 531). The authors are grateful to the Ministry of Science and Information Technology of Poland and the Foundry Research Institute for financial support.

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