Interaction of Ag-In-Sn Solders with Palladium Substrates: A Phase Diagram Approach

Adela Zemanova 1Ales Kroupa 3Jan Vrestal 1Herbert Ipser 2Christoph Luef 2Hans Flandorfer 2

1. Masaryk University, Faculty of Sciences, Kotlarska 2, Brno 61137, Czech Republic
2. University of Vienna, Department of Inorganic Chemistry - Materials Chemistry, Waehringerstr. 42, Wien A-1090, Austria
3. Czech Academy of Sciences, Institute of Physics of Materials (IPM), Zizkova 22, Brno 61662, Czech Republic


In order to understand the interaction of lead-free Ag-In-Sn solders with palladium substrates one has to know the quaternary Ag-In-Pd-Sn phase diagram, and for that all the constituent binaries and ternaries. For this purpose, enthalpies of mixing were determined calorimetrically for liquid ternary Ag-Pd-Sn and In-Pd-Sn and quaternary Ag-In-Pd-Sn alloys. These experimental results were taken into account as an input for the optimization in CALPHAD - type phase diagram calculations of the above-mentioned two ternary phase diagrams. These were then combined with an earlier optimization of the Ag-In-Pd system as well as with literature data on the Ag-In-Sn system to obtain a first idea of the phase diagram of the quaternary Ag-In-Pd-Sn alloy system. The calculations were supported by a number of specifically devised experiments.

Legal notice
  • Legal notice:

    Copyright (c) Pielaszek Research, all rights reserved.
    The above materials, including auxiliary resources, are subject to Publisher's copyright and the Author(s) intellectual rights. Without limiting Author(s) rights under respective Copyright Transfer Agreement, no part of the above documents may be reproduced without the express written permission of Pielaszek Research, the Publisher. Express permission from the Author(s) is required to use the above materials for academic purposes, such as lectures or scientific presentations.
    In every case, proper references including Author(s) name(s) and URL of this webpage: must be provided.


Related papers
  1. Comparison of wetting and mechanical properties of Cu/Sn-based solder couples produced under vacuum and under flux
  2. ELFNET: A European Network on Lead Free soldering
  3. The Experimental and Theoretical Study of the Pd-Sn-Zn System
  4. Developing New Lead-free Solder Materials: COST 531, a Concerted European Action

Presentation: poster at E-MRS Fall Meeting 2005, Symposium H, by Adela Zemanova
See On-line Journal of E-MRS Fall Meeting 2005

Submitted: 2005-05-18 18:43
Revised:   2009-06-07 00:44
© 1998-2021 pielaszek research, all rights reserved Powered by the Conference Engine