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Studies on graphite based anti static electromagnetic/radio frequency interference (EMI/RFI) shelding coating

Roohollah Reza soltani 1Ali asqar Sarabi 

1. Amirkabir University of Technology (AUT), Hafez, Tehran 15914, Iran

Abstract

 Electrically conductive coatings are mainly required for static charge dissipation and electromagnetic/radio frequency interference (EMI/RFI) shielding. Electrically conductive coatings are prepared by the incorporation of the metallic pigments/graphite or carbon black onto the binder.

In the present investigation a study on the correlation between electrical percolation ,filler volume concentration and some other physical and mechanical properties for graphite (GP) filled epoxy coating was carried out through an examination of the filler concentration  dependence of the volume resistivity and other mechanical properties.

 It is found that there are two critical threshold, in plot of electrical resistivity v.s. filler volume concentration.

 The impact strength of epoxy resin filled with graphite was also investigated. A decrease in impact strength with an increase in filler content was observed

  The adhesion of the filled resin to substrate was also determined by pull-off test. A decrease in the adhesion to substrate  with an increase in filler content was observed in

  Then to find out the correlation between filler concentration and viscoelastic behavior of the system Tensile test carried out.

  Then for expand a theory that can explain  the transfer between insulator-semi conductor and semi conductor-conductor behavior of graphite filled system images was gived by SEM and optical microscopy and also oil absorption (for determine CPVC)test carried out. All data show that formation of e internal network by graphite particles and particle by particle contact of them is the reason of formation a conductive network in epoxy system.

 

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Presentation: Oral at E-MRS Fall Meeting 2008, Symposium C, by Roohollah Reza soltani
See On-line Journal of E-MRS Fall Meeting 2008

Submitted: 2008-05-12 20:05
Revised:   2009-06-07 00:48