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Residual stress in Ni-Mn-Ga thin films deposited on different substrates

Stephen Doyle ¹, Volodymyr A. Chernenko ², Stefano Besseghini ³, Andrea Gambardella ³, Manfred Kohl ⁴, Peter Mullner ⁵, Makoto Ohtsuka ⁶

1. Forschungszentrum Karlsruhe GmbH, Institut für Synchrotronstrahlung, ANKA (ANKA), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Germany
2. Institute of Magnetism NASU (IMag), Vernadsky 36-b, Kyiv 03142, Ukraine
3. Istituto per l'Energetica e le Interfasi Consiglio Nazionale delle Ricerche Unità di Lecco (IENI Lecco), Corso Promessi Sposi, 29, Lecco 23900, Italy
4. Forschungszentrum Karlsruhe, IMT, Postfach 3640, Karlsruhe 76021, Germany
5. Department of Materials Science and Engineering, Boise State University, Boise 83725, United States
6. Institute of Multidisciplinary Research for Advanced Materials (IMRAM), Sendai 980-8577, Japan

Abstract

Great attention has been recently paid to the development and study of MSM Ni-Mn-Ga/substrate thin film composites. The workability and reliability of small-scale devices utilizing such materials is highly dependent on the residual stress which such thin films exhibit due to the thermal expansion and lattice mismatches.

In the present work we report on residual stress measurements by X-ray diffraction in the standard θ/2θ Bragg-Brentano geometry carried out at the ANKA synchrotron facility (FZK, Karlsruhe). In the method commonly known as “sin²ψ", the lattice spacing is assumed to be a linear function of sin²ψ, where ψ is the angle between the diffracting plane normal and specimen surface normal. A biaxial plane-stress model is then used to convert the measured strain into stress.

Four series of Ni_51.4Mn_28.3Ga_20.3/substrate thin film composites, where the substrates are either Si(100), MgO(100), alumina or molybdenum foil, and three series of Ni_53.5Mn_23.8Ga_22.7/substrate composites where the substrate is either Si(100), alumina or Mo foil, with different film thicknesses varying from 0.1 to 5μm have been studied in the cubic phase by XRD stress measurements. An analysis of the results was made assuming the value of Young modulus and Poisson ratio to be equal to 50 GPa and 0.3, respectively, for all the films. The zero-stress lattice spacing was determined from the condition of sin²ψ = 0. The estimated level of residual stress is found to vary from 0.12 GPa for the 1 μm-thick film on MgO(100) to 0.53 GPa for the 0.1 μm-thick film on Si(100). In addition, a weak thickness dependence of stress is observed for films on MgO or Mo while it is much stronger and has the opposite sign for films on alumina or Si(100). The results are relevant to the evaluation of stress-induced magnetic anisotropy of films.

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Residual stress in Ni-Mn-Ga thin films deposited on different substrates

Presentation: Poster at E-MRS Fall Meeting 2007, Symposium E, by Stephen Doyle See On-line Journal of E-MRS Fall Meeting 2007 Submitted: 2007-05-14 17:09 Revised: 2009-06-07 00:44

Presentation: Poster at E-MRS Fall Meeting 2007, Symposium E, by Stephen Doyle
See On-line Journal of E-MRS Fall Meeting 2007

Submitted: 2007-05-14 17:09 Revised: 2009-06-07 00:44